These specify the pitch (often as fine as 35 µm) and the physical layout of the copper foil on the polyimide film. Common COF IC Models
COF technology is essential for modern electronics with "slim bezels" because the film can be folded, allowing the driver IC to be tucked behind the display panel.
A (Chip-on-Film) is a technical document that outlines the electrical, mechanical, and functional specifications of a driver integrated circuit (IC) mounted on a flexible film substrate. These sheets are vital for engineers and technicians repairing LCD, LED, and OLED display panels, as they provide critical "pinout" data required for "flying line" repairs—restoring broken signals by bypassing damaged film traces. Core Components of a COF Data Sheet
: Clearly define the materials for which you are measuring COF.
